China: Huawei unveils new AI chips, computing systems at Shanghai conference.

SHOTLIST: SHANGHAI, CHINA (SEPT. 17, 2026) 1. VARIOUS OF HUAWEI CONNECT CONFERENCE IN SHANGHAI / HUAWEI DEPUTY CHAIRMAN WANG TAO DELIVERING PRESENTATION / ATLAS 960E SUPERPOD COMPUTING CLUSTER BEING UNVEILED AND PRESENTED SHANGHAI, CHINA - SEPT. 17: Chinese technology company Huawei unveiled new microchips and computing cluster systems for artificial intelligence at its Huawei Connect conference in Shanghai on Thursday, Sept. 17. Huawei Deputy Chairman Wang Tao introduced new versions of the company's Ascend graphics processing units and Atlas SuperPoD computing systems during the opening of the conference. Wang said the Ascend 960DT chip, designed for training AI models, is scheduled for release in the first quarter of 2027, while the Ascend 960PR, intended for AI inference operations, is expected in the third quarter of the year. The company also plans to launch its next-generation Ascend 970 and Ascend 980 chips in 2028 and 2029, respectively. Huawei also announced changes to its Atlas SuperPoD computing infrastructure, with the upcoming Atlas 960E SuperPoD set to use near-packaged optics, or NPO, technology for optical connections between circuits and components instead of electrical connections. The system, which combines multiple graphics processing units, is designed to accelerate the training and inference of AI models with up to 10 trillion parameters. Wang also said Huawei aims to use its "Tau Scaling Law" approach to develop semiconductor circuits by 2031 with performance equivalent to 1.4-nanometer chips without relying on advanced lithography equipment.